Power Module Material：Ceramic+FR4+Copper base Layer Coverage：4 Layers+Copper base Surface Technique：Immersion Gold Specialty：Ceramic+FR4 Multiply materials copper-clad laminate. O-E Module Material： Ceramic+FR4 Layer Coverage：6 Layers Thickness：1.0 mm Surface Technique：Gold-plate +finger Specialty：Embedded Orientation. Embedded Systems Material：FR4 Layer Coverage：8 Layers Thickness：1.6 mm Surface Technique：HAL Line Width/Space：4mils/4mils Solder Mask Colour：Yellow. DC/DC Power Module Material：Hi-Tg (170℃)、FR4 Layer Coverage：10 Layers Thickness：1.6 mm Surface Technique：Immersion Gold Specialty：Copper Weight 105 um Blind-via/Buried-via Larger Current . Telecommunication base-station Material：FR4 Layer Coverage：8 Layers Thickness：2.0 mm Surface Technique：HAL Line Width/Space：4mils/4mils Specialty：BGA、Impedance Control、Shade Solder. Data Collect Material：FR4 Layer Coverage：6 Layers Thickness：1.6 mm Surface：Electrolytic Au + Finger Au Weight Of Finger：30 Microinch Solder Mask Colour：blueBlind-via.