Stannum
Sn
Specification:
High purity Sn: 99.999% Sn-5N-I-15
Testing impurity: Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Zn
Total impurity content: ≤10ppm
High purity Sn: 99.9999% Sn-6N-I-16
Testing impurity: Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni, Zn
Total impurity content: ≤1ppm
High purity Sn: 99.99999% Sn-7N-I-17
Testing impurity: Ag, Al, Au, Ca, Cu, Fe, Mg, Ni, Zn
Total impurity content: ≤0.1ppm
Application: Tin is used in the manufacture of compound semiconductor, high purity alloy, superconducting material, solder and as a dopant of compound semiconductor.
Package: Packed with terylene film, and double poly-film with vacuum encapsulation. Packed with glass tube with vacuum encapsulation directly.